Thermal diamond film

Leveraging CVD diamond technology, it delivers a thermal conductivity of 1000-2000 W/(m·K)—over 5 times that of copper. With an ultra-thin profile of 0.1-0.5mm and high-voltage insulation capabilities, it is ideal for high power density heat dissipation applications.

Material

CVD Diamond

Tolerance

±0.01mm

Surface Treatment

Double-sided polishing

Application Areas

5G Communication Base Stations, High-Power LEDs, Laser Devices, IGBT Modules, CPU/GPU Thermal Management, Aerospace Electronic Equipment

Product Features

Ultra-high thermal conductivity
Superior Insulation Performance
Ultra-thin and lightweight
High temperature and high pressure resistant
Low Coefficient of Thermal Expansion
Good chemical stability

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