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CVD Carbon Thermal Film
Thermal conductivity: 2000-2300 W/m·K. Ideal for AI chip near-junction cooling, high-end laser optical windows, 5G millimeter-wave high-frequency device substrates, and quantum computing chip packaging.
Material
CVD Carbon
Application Areas
AI chip near-junction thermal management, high-end laser optical windows, 5G mmWave high-frequency device substrates, and quantum computing chip packaging
Product Features
- Ultra-high thermal conductivity, thin and lightweight, flexible, excellent chemical stability