Return to Product Center
Get in touch
Ultra-low profile copper foil
Ultra-low-profile copper foil (also known as ultra-low-profile or compute-grade copper foil) is an advanced thermal management material designed for high-compute scenarios. With an extremely low surface roughness (Ra ≤ 0.3 μm) and thermal conductivity of 398W/m·K, it supports high-speed signal transmission and efficient heat dissipation in AI servers, data centers, and high-performance computing environments.
Material
High-purity electrolytic copper (purity ≥ 99.9%)
Application Areas
AI server GPU/CPU cooling modules, high-speed data center PCBs, 5G base station RF modules, high-performance computing chip packaging, and new energy vehicle powertrain control systems
Product Features
- Ultra-low surface roughness
- Excellent high-frequency signal transmission performance
- High thermal conductivity
- Excellent machinability
- Suitable for high-speed, high-frequency scenarios