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PCB Materials
PCB substrate is made from electrolytic copper foil composite material through processes such as etching, drilling, and electroplating. It offers excellent electrical performance, mechanical strength, and heat resistance, with high circuit precision and reliability. Capable of multi-layer lamination and surface treatment, it is suitable for applications in communications, automotive electronics, consumer electronics, industrial control, and more.
Material
Electrolytic Copper Foil + Shielding Film
Tolerance
Line accuracy: ±0.05mm, hole tolerance: ±0.02mm
Surface Treatment
HASL, ENIG, OSP, Silver Plating, Gold Plating
Application Areas
Communication equipment, automotive electronics, consumer electronics, industrial control equipment, and medical devices.
Product Features
- Excellent electrical performance and stable signal transmission
- High mechanical strength and excellent heat resistance
- High-precision circuitry with excellent reliability
- Multi-layer lamination available; diverse surface finishes
